Vorrichtung zum Polieren von Halbleiterscheiben

摘要

There is disclosed a wafer-polishing apparatus suitably designed to carry out a chemical mechanical polishing operation. The apparatus includes a lower polishing plate assembly (100), a first rotating mechanism (125) for rotating the first polishing plate assembly (100), an upper polishing plate assembly (6), a second rotating mechanism (70,72) for rotating the upper polishing plate assembly (6), a pressing mechanism (68), a conveying mechanism (4) and a discharging mechanism (16). The lower polishing plate assembly (100) includes a lower polishing plate (102), a polishing pad (106), a porous sheet (104) interposed between the lower polishing plate (102) and the polishing pad (106). The porous sheet (104) has a thickness of 0.5 to 3 mm, and is formed of a foaming resin. The upper polishing plate assembly (6) includes an upper polishing plate (82), a plate-like chuck (84) and a backing pad (84B), a pressure reducing unit (PR), and a cleaning unit (c).