发明名称 |
Bending sensor |
摘要 |
A bending sensor of the invention is formed of a flexible segment, a pressure-sensitive electrically-conductive resin film formed on the flexible segment, and a pair of electrodes to be attached to the resin film. The resin film is made of pressure-sensitive electroconductive ink and coated on the segment. The resin film has a characteristic such that an electric resistance value is reduced as a pressure on the resin film increases. When the segment is bend-formed at an inflection point by receiving an outer force, the segment provides a pressure to the resin film at the inflection point to produce an inner stress in the resin film. When the segment is bent-deformed, the electrodes output a resistance change of the resin film to thereby detect bending of the flexible segment.
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申请公布号 |
US5652395(A) |
申请公布日期 |
1997.07.29 |
申请号 |
US19960654908 |
申请日期 |
1996.05.29 |
申请人 |
HIRANO ELECTRONICS CO. LTD. |
发明人 |
HIRANO, TERUAKI;KIKUCHI, NOZOMU;SAITO, KAZUMASA |
分类号 |
G01L1/18;G01B7/16;G01B7/28;G01N3/06;(IPC1-7):G01N3/20 |
主分类号 |
G01L1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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