发明名称 Bending sensor
摘要 A bending sensor of the invention is formed of a flexible segment, a pressure-sensitive electrically-conductive resin film formed on the flexible segment, and a pair of electrodes to be attached to the resin film. The resin film is made of pressure-sensitive electroconductive ink and coated on the segment. The resin film has a characteristic such that an electric resistance value is reduced as a pressure on the resin film increases. When the segment is bend-formed at an inflection point by receiving an outer force, the segment provides a pressure to the resin film at the inflection point to produce an inner stress in the resin film. When the segment is bent-deformed, the electrodes output a resistance change of the resin film to thereby detect bending of the flexible segment.
申请公布号 US5652395(A) 申请公布日期 1997.07.29
申请号 US19960654908 申请日期 1996.05.29
申请人 HIRANO ELECTRONICS CO. LTD. 发明人 HIRANO, TERUAKI;KIKUCHI, NOZOMU;SAITO, KAZUMASA
分类号 G01L1/18;G01B7/16;G01B7/28;G01N3/06;(IPC1-7):G01N3/20 主分类号 G01L1/18
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