HEATING AND COOLING DEVICE AND VACUUM TREATING DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a heating and cooling device capable of controlling the temp. of a work to a desired temp. by minimizing the temp. rise of this work even when heat flows into the work and a vacuum treating device using the same. SOLUTION: A vacuum treating vessel 3 having a sputtering source 2 has the heating and cooling device therein. The heating and cooling device is composed of a heating section 4 and a cooling section 5 which are tightened by means of lock screws 7. The heating section 4 for heating an Si wafer is internally provided with a heater 8 connected to a DC power source 9. This DC power source 9 is subjected to PID control by a thermocouple and a control means 10. The cooling section 5 is internally provided with a circulating path 12 for circulating a cooling medium.