| 摘要 |
PROBLEM TO BE SOLVED: To obtain a conductive resin paste compsn. reduced in moisture adsorption and improved in peel strength by using an epoxy resin contg. a specific component, a curing agent and a conductive filter. SOLUTION: A hundred (100) pts.wt. epoxy resin mixture comprising 1.0-90wt.% epoxy resin contg. at least 10wt.% component of the formula (wherein n is 0 to 5) and 0-90wt.% other epoxy resin is blended with 0.01-90 pts.wt. curing agent, at most 30.0wt.% curing accelerator, 5.0-95.0wt.% flaky, arborescent, spherical or amorphous conductive filler, and 1-30wt.% org. solvent or reactive diluent having one to two epoxy groups per molecule, and, if necessary, heated to effect mixture, dissolution, deagglomeration, and kneading or dispersion thereof. |
