| 摘要 |
The present invention is to provide a heat dissipator mounting apparatus having a rigid plate, a pressing plate and a snapping plate wherein; both the rigid plate and the pressing plate are bent upward, hence providing a resilient force. One side of the rigid plate is provided with an opening and the other side a downward bending inclined surface; one side of the pressing plate is provided with a downward bending inclined surface and the other side with a positioning recess; a plane surface formed on top of the snapping plate is provided as the applied place where external force applies, whose both sides are provided with a recess for connecting with the positioning recess of the snapping plate. Consequently, using the upward resilience of the pressing plate, the heat dissipator and the CPU are thus firmly connected together.
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