| 摘要 |
PROBLEM TO BE SOLVED: To reduce step difference between a template and a semiconductor substrate by controlling a jig so that the surface of the jig opposite to an abrasive cloth and the surface of a material to be polished are flush with each other. SOLUTION: Height adjusting mechanisms 5 are provided on the opposite side to templates 2 through a suction board 1. The suction board 1 is provided with four through holes 9, and the template 2 and the height adjusting mechanism 5 are connected together through a shaft 6 inserted through the through hole 6. The height adjusting mechanism 5 adds air pressure or the like to the shaft 6 fixed to the template 2, measures pressure added to the surface of the template 2, and controls pressurization for the shaft 6 according to the measured value of the pressure. As for the template 2, a substance in which SiO is vapor- deposited on a sintered object made of SiC and the like for example by the CVD method, is used. Hereby, an abrasive cloth 4 can be prevented from being made round along the step difference between a semiconductor substrate 3 and the templates 2, and further the semiconductor substrate 3 can be prevented from being contaminated. |
