Semiconductor device with a convex heat sink

摘要

A semiconductor device with a convex heat sink comprises: a semiconductor element disposed within a space formed by leads of a lead frame, the semiconductor element having bonding pads connected to the leads through wires respectively; a convex heat sink made from a high heat-conductive material and formed so as to have an outer periphery of a size sufficiently large to overlap the leads, the semiconductor element being disposed at a center portion of the heat sink; an insulator disposed on the leads and for bonding and fixing the semiconductor element to the heat sink; and a package of resin for sealing except part of the leads and the top surface of a projecting portion of the heat sink; wherein the insulator has a shape like a tape so as to cover part of the leads and extend along a bottom surface near a circumferential edge of the heat sink, and the side surface of the projecting portion of the heat sink is scraped out into a curved surface.