发明名称 Use of reticle stitching to provide design flexibility
摘要 A method and apparatus for forming large scale fields suitable for use in the fabrication of integrated circuit structures having submicron dimensions. The method includes subdividing the large scale field into a plurality of subfields along the boundaries of functional components forming a very large scale integrated circuit. Stitching the subfields into the large scale field is then substantially simplified since the number and dimensions of conductive interconnects between the functional components can be more easily accommodated.
申请公布号 US5652163(A) 申请公布日期 1997.07.29
申请号 US19940357728 申请日期 1994.12.13
申请人 LSI LOGIC CORPORATION 发明人 SCHINELLA, RICHARD D.;CHAO, KEITH
分类号 G03F7/20;H01L27/02;(IPC1-7):H01L21/82 主分类号 G03F7/20
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