发明名称 |
Use of reticle stitching to provide design flexibility |
摘要 |
A method and apparatus for forming large scale fields suitable for use in the fabrication of integrated circuit structures having submicron dimensions. The method includes subdividing the large scale field into a plurality of subfields along the boundaries of functional components forming a very large scale integrated circuit. Stitching the subfields into the large scale field is then substantially simplified since the number and dimensions of conductive interconnects between the functional components can be more easily accommodated.
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申请公布号 |
US5652163(A) |
申请公布日期 |
1997.07.29 |
申请号 |
US19940357728 |
申请日期 |
1994.12.13 |
申请人 |
LSI LOGIC CORPORATION |
发明人 |
SCHINELLA, RICHARD D.;CHAO, KEITH |
分类号 |
G03F7/20;H01L27/02;(IPC1-7):H01L21/82 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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