| 摘要 |
PROBLEM TO BE SOLVED: To obtain a sealing resin composition improved in marketability with YAG laser or carbon dioxide laser beams by mixing an epoxy resin with a phenolic resin curing resin, a cure accelerator, an inorganic filler, carbon black, and mica. SOLUTION: This composition essentially consists of an epoxy resin, a phenolic resin curing agent, a cure accelerator, an inorganic filler, carbon black having a means particle diameter of 5-150nm in a state of primary particles, and mica (K2 O.3Al2 O3 .6SiO2 .2H2 O). The amount of the mica used is desirably 0.02-2wt.% based on the whole composition. This composition can give semiconductor packages highly markable with YAG or carbon dioxide laser beams which give marks of high contrast without causing the packages to produce much soot and therefore it can contribute to the improvement of productivity and the reduction of production cost. |
