| 发明名称 |
PRODUCTION OF SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PURPOSE:Dicing yield is improved by cutting grooves not reaching substrate in an insulation and protection film covering the mesa grooves formed on the substrate, forming scribe lines down to the substrate from said grooves with a laser beam then dicing the substrate.</p> |
| 申请公布号 |
JPS52141178(A) |
申请公布日期 |
1977.11.25 |
| 申请号 |
JP19760058080 |
申请日期 |
1976.05.19 |
| 申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
FUJII TOSHIYUKI;OONO KATSUHIRO |
| 分类号 |
H01L21/301;H01L21/302;H01L21/31;H01L21/316 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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