Producing wire segments of hard solder containing copper@

摘要

The method consists of extruding, out of a hard solder block (4), a wire bundle (5) through a die (2), subsequently quenching the bundle by means of water spray, and cutting it into segments of specified length. The wire bundle is extracted in the horizontal direction, continuously under a tensile stress until the end of the extrusion process, over a seating surface (9), and is placed onto this surface. The water spray is directed onto the wire bundle in a horizontal quenching channel (3) which adjoins the die (2) without an air gap, and is closed along its circumference. Individual wires (5a) are taken from the surface (9), and are cut into segments. Also claimed is the apparatus for implementation of the method.