| 摘要 |
1492478 Component assemblies; semiconductor mountings INTERNATIONAL BUSINESS MACHINES CORP 31 Oct 1975 [31 March 1975] 45261/75 Headings H1K and H1R An aircooled package 10 for electrical components comprises (Fig. 1) a wafer assembly 12, a pin carrier assembly 14, a heat sink cover 16, and a frame 18; the wafer assembly having circuit networks thereon of copper or aluminium processed in known manner. The wafer assemby may be soldered to a molybdenum stiffener (not shown) and may support (Fig. 3) plural integrate flip chip circuits interconnected with the circuit networks, or may have integrated circuit islands formed therein. Pin carrier assembly 14 comprises a multilayer ceramic board 24 carrying further flip chip devices 26 and a ring of connection jumpers or spring contacts 28 peripherally arranged in quadranted groups 28a to 28d with multiple connecting pins 29 extending through the board to interconnect with the chip devices 26 and the fingers or contacts 28, which in turn connect with a conductive path network comprising contact pads peripherally of the wafer assembly. The jumpers 28 may be soldered for rigidity to the perimeter of the wafer. The whole assembly fits into a recess 34 of the cover 16, which is finned for heat dissipation and the outer edge of frame 18 is received in a recess 40; with a central aperture passing pins 29 and being sealed with potting material 42. A layer 20 of high heat conductivity grease is interposed between the inside of cover 16 and the surface of the wafer assembly. The jumpers 28 may be of spring material to exert pressure between wafer and cover. |
