A SEMICONDUCTOR DEVICE WITH A LOW RESISTANCE OHMIC CONTACT BETWEEN A METAL LAYER AND A SiC-LAYER

摘要

A semiconductor device comprises a semiconductor layer (1) of SiC, a metal layer (2) adapted to form a low resistance ohmic contact with the SiC-layer and a thin layer (3) of a material having a smaller bandgap than the SiC of the SiC-layer placed between the SiC-layer and the metal layer. The SiC-layer is at least in the region next to said thin layer highly doped. The material of said thin layer is a Group 3B-nitride.