| 摘要 |
<p>A resist film coating apparatus comprises a resist receiving plate secured to a rotatable support plate carrying a wafer so as to be disposed along the outer periphery of the wafer, an interference type film thickness meter for measuring the thickness of a resist film spun out to the resist receiving plate, and modifying means for changing the revolution number of the support plate on the basis of a result of measurement by the film thickness meter such that a desired resist film thickness can be obtained.</p> |
