发明名称 |
REEZAMAMOMASUKUOYOBISONOSEIZOHOHO |
摘要 |
A laser ablation mask and a method of fabrication therefor. The mask has a pattern of clear areas and scattering areas. The scattering areas are covered with randomly formed facets. The facets act as scattering centers. Areas clear of facets transmit laser energy. Scattering areas refract laser energy. Laser energy directed at the mask, will pass through the clear mask areas to selectively ablate an organic layer placed opposite the mask. However, laser energy is scattered when striking and passing through the scattering areas such that insufficient laser energy passes directly through the mask to reach the organic layer for ablation to occur. The mask is formed by depositing and patterning a metal mask layer on a quartz plate. The patterned mask layer protects intended clear areas. Scattering areas are formed in unprotected plate areas by subjecting the plate to a polymethacrylic acid/bifluoride solution. |
申请公布号 |
JP2634152(B2) |
申请公布日期 |
1997.07.23 |
申请号 |
JP19950011193 |
申请日期 |
1995.01.27 |
申请人 |
INTAANASHONARU BIJINESU MASHIINZU CORP |
发明人 |
REON EICHI KAPURAN;DORISU HOORINA PURASUKII |
分类号 |
B23K26/06;G03F1/00;G03F7/40;H01L21/027 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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