| 摘要 |
An optical isolator unit (36) is aligned, assembled, and subsequently diced into smaller isolator chips (26; 46; 62) for placement in a micro-optical bench (29; 59) along with input and an output fiber (21,22,50) coupling ball lenses (25,27; 54,57). Polarizers (49) (for polarization-dependent isolators) or birefringence walkoff crystals (35) (for polarization-independent isolators) are aligned and then glued together with 45 DEG Faraday rotators (39,45) using an optical-grade adhesive. The surfaces of the component are AR-coated to match the index of the optical-grade adhesive. An optical isolator unit (36) formed in this manner is then diced into a plurality of optical isolator chips (26,46; 62) with a high-speed wafer saw. The optical isolator unit (36) is preferably mounted on any one of its sides in such a way that only a smallest possible cutting depth is required for dicing, that is it is mounted such that a thinnest dimension of the isolator (20) is presented for cutting, such that material loss due to cutting is reduced and delamination of the optical isolator chips is prevented. <IMAGE> |
