| 摘要 |
PURPOSE:To eliminate the oblique formation of the side face of a chip by forming weakening lines at positions opposed to lateral and longitudinal grooves for division in the rear surface of a substrate continuously or intermittently. CONSTITUTION:Weakening lines 8, 9 are formed at positions opposed to laterally and longitudinally dividing grooves on the rear surface of a ceramic substrate 1 formed with laterally and longitudinally dividing grooves 3, 4 on the front surface to form a chip of a chip resistor or the like continuously or intermittently. Accordingly, in order to remove edge pieces 5, 5 at both upper and lower sides when the substrate 1 is longitudinally divided in a rectangular state, it is divided at the lateral dividing grooves 4, 4 along the pieces 5, 5, and may then be divided along the longitudinal dividing grooves 3. The grooves 3 on the front surface of the board 1 are opposed to the lines 8 on the rear surface. Thus, isolating lines 10 are advanced perpendicularly from the front surface of the substrate 1, thereby eliminating the oblique formation of the side end faces of the chip 2 and the generation of the burred protrusion. |
