发明名称 |
Device for coating substrates in semiconductor production |
摘要 |
A device for coating substrates has a capillary slot which is used in a first step to apply lacquer to the substrate. In a second step, the lacquer layer thickness of the substrate is reduced and made more uniform by spinning in a spinning device.
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申请公布号 |
US5650196(A) |
申请公布日期 |
1997.07.22 |
申请号 |
US19940268845 |
申请日期 |
1994.06.30 |
申请人 |
STEAG MICROTECH GMBH |
发明人 |
MUEHLFRIEDEL, EBERHARD;APPICH, KARL;KALLIS, MARTIN |
分类号 |
B05C9/02;B05C9/12;B05C11/08;B05C11/105;B05D1/00;B05D1/26;C23C2/00;(IPC1-7):B05D3/12 |
主分类号 |
B05C9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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