发明名称 Device for coating substrates in semiconductor production
摘要 A device for coating substrates has a capillary slot which is used in a first step to apply lacquer to the substrate. In a second step, the lacquer layer thickness of the substrate is reduced and made more uniform by spinning in a spinning device.
申请公布号 US5650196(A) 申请公布日期 1997.07.22
申请号 US19940268845 申请日期 1994.06.30
申请人 STEAG MICROTECH GMBH 发明人 MUEHLFRIEDEL, EBERHARD;APPICH, KARL;KALLIS, MARTIN
分类号 B05C9/02;B05C9/12;B05C11/08;B05C11/105;B05D1/00;B05D1/26;C23C2/00;(IPC1-7):B05D3/12 主分类号 B05C9/02
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