| 摘要 |
Composition and method for a conductive interconnection composition in bonding relation with electronic components including combining and upon combining expressing from a mix tip onto conductive portions of electronic components a silver filled first side urethane resin precursor comprising an aliphatic isocyanato reagent and a silver filled second side urethane resin precursor comprising a polyol reagent immediately reactive with the first side precursor isocyanato reagent, the silver being present in the composition in an amount sufficient to conduct electricity to and from the electronic components.
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