| 摘要 |
PROBLEM TO BE SOLVED: To enable the optimum focus position adjustment and leveling of a wafer, according to the surface condition of the wafer. SOLUTION: This device has an XY stage on which to place a wafer W. The XY stage 8 has a leveling stage 9 capable of adjusting the focus position and the leveling condition. Moreover, this device has focus sensors 3-7 and 13-17 which detect the level position of the wafer W. When performing the condition control (focus adjustment and leveling adjustment) of the surface of the wafer, from the signal from the focus sensors 3-7 and 13-17, the measured values are graded according to the surface condition of the wafer W, or the condition control of the surface of the wafer W is performed separately for each partial region of the wafer W. |
