发明名称 High speed semiconductor device with a metallic substrate
摘要 PCT No. PCT/JP93/01850 Sec. 371 Date Aug. 10, 1995 Sec. 102(e) Date Aug. 10, 1995 PCT Filed Dec. 21, 1993 PCT Pub. No. WO94/15366 PCT Pub. Date Jul. 7, 1994The semiconductor device has a large capacity of power driving, and can operate at a high speed. A first semiconductor region of a first conductivity type is formed on a metal substrate through a first insulating film. In the first semiconductor region, first source and drain regions of a second conductivity type are formed. Further, on the region which isolates the first source and drain regions, a first metallic gate electrode is formed through a second insulating film.
申请公布号 US5650650(A) 申请公布日期 1997.07.22
申请号 US19950454324 申请日期 1995.08.10
申请人 OHMI, TADAHIRO 发明人 OHMI, TADAHIRO;SHIMADA, HISAYUKI;HIRAYAMA, MASAKI
分类号 H01L29/78;H01L21/28;H01L21/316;H01L21/336;H01L23/14;H01L27/06;H01L27/092;H01L27/12;H01L29/49;H01L29/51;H01L29/786;(IPC1-7):H01L27/01 主分类号 H01L29/78
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