SEMICONDUCTOR WAFER FIXING SHEET

摘要

PROBLEM TO BE SOLVED: To make it possible to obtain a long-term antistatic effect by laminating an antistatic material layer between a substrate sheet and an adhesive material layer with an amount of lamination in a specified range. SOLUTION: As an antistatic material layer 1, an antistatic material of acrylic copolymer is applied to one surface of a substrate sheet 2 of polyvinyl chloride and is laminated. At this time, the amount of lamination is 0.01 to 5.0g/m<2> and coating is performed by a gravure coater. On the surface at the opposite side of the antistatic material layer 1, an acrylic adhesive is coated with Comma roll coater to form an adhesive material layer 3. Finally, a peel-off paper S is adhered to the surface of the adhesive material layer 3. Fixing sheet obtained is charged, and the half life of charge was measured, and an effect of prohibiting electrostatic charge, which was generated in dicing or back grind process or when peeling off the peel-off paper, to a semiconductor wafer over a long period of time was recognized.