| 摘要 |
PROBLEM TO BE SOLVED: To improve the accuracy of securing an optical semiconductor element on a mount board to be mounted with an optical element in the direction of bonding, and prevent a metal alloy for bonding from flowing out to the light receiving surface or light emitting surface of the semiconductor element, by forming a step on the mount board in the position where the optical semiconductor element is to be secured. SOLUTION: A terrace 4 is formed on a silicon substrate 3 by etching, and a lower clad layer is formed. The lower clad layer is polished to the level of the terrace 4, and then a core layer is deposited. A pattern is formed, and recesses 5 of step structure, a waveguide 8 and a mating mark 7 are formed. An upper clad layer is formed, and then the terrace 4 is exposed. An optical semiconductor element 1 is fixed on the terrace 4 for alignment. Because of the presence of the recesses 5 for joining, a metal alloy film 6 for bonding stays within the recesses 5, and is prevented from flowing out to the end faces of semiconductor elements to be mounted. The semiconductor elements 2 are secured in an element mounting sections, and are connected with each other using a gold wire. |
