发明名称 MANUFACTURE OF CHIP TYPE COIL
摘要 PROBLEM TO BE SOLVED: To manufacture a chip-type coil with high dimensional accuracy and besides at low cost by forming a conductive film to serve as a terminal electrode on one main face of an insulating board, and then, forwing a groove for a recess to serve as a recess between feet, and dividing this insulating board to get a plurality of cores, and winding a wire on the winding part of each core, and connecting the wire to a terminal electrode. SOLUTION: Using a dicing blade 33, a plurality of grooves 34 of division are made on one main face of an insulating board 30, and then a conductive film 35 to serve as a terminal electrode is made. Next, using a dicing blade 36, a groove 37 for recess to serve as a recess between plural feet is made at one main face of the insulating board 30 where the conducive film 35 is made. Next, a dicing blade 38 is made to work along the groove 34 for division to make a slot 39 in the insulating board 30, and the insulating board 30 is divided. Next, a wire is wound on the winding part of the core, and each terminal of this wire is connected to a terminal electrode.
申请公布号 JPH09190942(A) 申请公布日期 1997.07.22
申请号 JP19960002743 申请日期 1996.01.11
申请人 MURATA MFG CO LTD 发明人 HATANAKA TETSUO
分类号 H01F27/02;H01F27/29;H01F41/04;(IPC1-7):H01F41/04 主分类号 H01F27/02
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