MANUFACTURE OF SOLDER-BUMPED SEMICONDUCTOR DEVICE,申请号JP19960003759-传众专利搜索

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发明名称	MANUFACTURE OF SOLDER-BUMPED SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH09191013(A)	申请公布日期	1997.07.22
申请号	JP19960003759	申请日期	1996.01.12
申请人	TOSHIBA MICROELECTRON CORP;TOSHIBA CORP	发明人	HIRANO NAOHIKO;DOI KAZUHIDE;OKADA TAKASHI;HIRUTA YOICHI;TAKUBO TOMOAKI;TAZAWA HIROSHI;HOSOMI HIDEKAZU;SHIBAZAKI YASUSHI
分类号	H05K3/34;H01L21/321;H01L21/60;(IPC1-7):H01L21/321	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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