发明名称 WIRE BONDER
摘要 PROBLEM TO BE SOLVED: To obtain an apparatus capable of miniaturization of a swing drive mechanism to a wire bonding tool, smooth and high speed operation, and reduction of work time, by installing a lower clamper swinging mechanism and a swinging mechanism for swinging a capillary arm, as mutually independent bodies. SOLUTION: This apparatus is provided with the following: an apparatus main body 20, a wire feeder 21, a lower clamper 31 which clamps or relieves at a right time a wire 22 sent out from the wire feeder 21 and is pivotally supported in the wire sending direction, and a capillary arm 32 positioned in the vicinity of the lower clamper 31 which arm is pivotally supported in the wire sending direction and has a capillary 32 for inserting a wire 22 on one end. In this wire bonding apparatus, a lower clamper swinging mechanism 30 which swings the lower clamper 31, and a swinging mechanism 35 which swings the capillary arm 32 are installed as mutually independent bodies.
申请公布号 JPH09191023(A) 申请公布日期 1997.07.22
申请号 JP19960001625 申请日期 1996.01.09
申请人 TOSHIBA CORP 发明人 KUBO TETSUYA
分类号 H01L21/60 主分类号 H01L21/60
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