| 摘要 |
In the chip cards to be produced, besides the integrated circuit components (chip 2 and/or electronic module 12) and coupling means (coil 6, capacitor coatings 8) for contactless power and/or data transmission there is also at least one label (1) forming the outer surface of the card. The coupling means (6, 8) are applied to the inner side of said label. The label (1), thus prepared, is then inserted into an injection mould. The separately prepared integrated circuit components (12) are then positioned accurately in the mould via terminals in the coupling means (6, 8) and contacted with them. Finally the card body is moulded on the label (1) by the injection moulding process and the integrated circuit components (2, 12) are moulded into the card body. Electric connections between the coupling means (6, 8) and the integrated circuit components (12) are produced in the mould itself by various means. |
