| 摘要 |
<p>A method and a device are provided for obtaining semiconductor bars for laser devices starting from portions of a processed wafer and carrying out the cleavage in ultra-high-vacuum. The cleavage mechanical stresses are impulsive forces and are all applied from the processed side of the wafer through a lowerable shaped member actuated by compressed helical springs, which applies these stresses on the ledging parts of the wafer portion hold on the central region thereof by a fixed support and hold down in position by a suitably shaped centering thrust member. The spring-up occurs by translating the device in the ultra-high-vacuum environment and contrasting a locking lever engaging the lowerable member in its upper position with a fixed cam. <IMAGE> <IMAGE></p> |
