| 摘要 |
<p>A printed wiring board (1) such that openings (8L) formed around a pad (12L) which is a photo-via land do not overlap a pad (12L) and the area of each of the openings (8L) around the pad (12L) is equal to that of each of the other openings (8), the amount of resin (13) with which each of the openings (8, 8L) is filled is equal to that with which each of the openings (8L) is filled over the whole wiring board (1), and the amounts of resin (13) overflowing from the openings (8, 8L) are equal to each other. The circuit pattern provided on the upper surface of an interlayer insulating layer formed on the printed wiring board can be connected to a conductor pad area without causing any defective connection, providing a highly-reliable printed wiring board.</p> |
