| 摘要 |
<p>The invention relates to a process for fabricating a coating layer (8) as well as a portable support (1) provided with such layer, comprising a support body (3) provided on one of its sides (4) with said coating layer (8). The process of the invention is characterized in that, for the fabrication of the coating layer (8), a transient thermoplastic layer (17) is cross-linked so as to make it thermosettable. The invention applies particularly to the fabrication of chip-based cards.</p> |
