| 摘要 |
A carrier tape paper of high quality for chip-shaped electronic parts, which has excellent features such as inexpensive manufacturing cost, ease of handling due to weight of the tape, ease of waste disposal after use, recyclability after use and an antistatic property. Further, the invention provides a carrier tape paper for chip-shaped electronic parts, which is good in quality and is adequate in thickness due to the use of a multi-layered paper which is formed by bonding sheets of paper together. The invention comprises a carrier tape paper for chip-shaped electronic parts, which is subjected to electric conductive treatment or rust preventive treatment with respect to metal or has a cover layer of heat sealing property. Further, the carrier tape paper for chip-shaped electronic parts is such that a tape-shaped paperboard comprises a multi-layered paper composed of a stuck paper which is formed by laminating sheets of paper together through adhesive layers, and the adhesive layers in the multi-layered paper comprise plastic adhesive layers which are displaced when shear stresses act between the stuck sheets of papers, which constitute the multi-layered paper, and permit the displacement to be restored when the shear stresses disappear.
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