An electronic package which has a plurality of stacked integrated circuit dies. The package includes a first die (12) that is mounted to a die paddle (16) of a lead frame (18). The first die is also connected to the leads of the lead frame by bond wires (28). A second die (14) is mounted to the top surface of the first die and electrically connected to the first die with bond wires. The first die, second die and die paddle are all enclosed by a package.
申请公布号
WO9725742(A1)
申请公布日期
1997.07.17
申请号
WO1996US20865
申请日期
1996.12.30
申请人
INTEL CORPORATION;LODER, WILLIAM, G.;MCMAHON, JOHN, FRANCIS