PROCESS FOR TREATING SEMICONDUCTOR FABRICATION RECLAIM

摘要

The hydrophilic organic contaminants and hydrogen peroxide present in semiconductor fabrication reclaims are removed by means of adsorption of a pyrolysate of a macroreticular sulphonated vinyl- aromatic polymer having a carbon content of at least 85% by weight and a carbon/hydrogen atomic ratio of from 1.5:1 to 20:1. In spite of their hydrophobic surface, the pyrolysates have a comparatively high adsorptivity for these contaminants and provide for distinctively higher removal rates than customary activated carbons.