发明名称 DANNETSU*BOSHITSUZAINOSEIZOHOHO
摘要 <p>PURPOSE:To provide the technique to manufacture a heat insulation/moisture- proof material, for an unfloored part, which does not become warped and deformed. CONSTITUTION:A heat insulation/moisture-proof material is manufactured by feeding a thin heat insulation synthetic resin film 4 with the same width as a foamed polystyrene board 2 to the top of the foamed polystyrene board 2 and a thick moisture-proof synthetic resin film 3 with a larger width than the foamed polystyrene board to the lower surface of the board 2, and at the same time, allowing the foamed polystyrene board 2 to pass through a pair of heating rolls 5, 6. In this case, the part, with which only the moisture-proof synthetic resin film 3 comes in contact of the heating roll 6 is maintained at a lower temperature than the other part. In addition, the tension of the moisture-proof synthetic resin film 3 to be fed to the lower surface of the foamed polystyrene board 2 is reduced to 1/3 to 2/3 that of the heat insulation synthetic resin film 4 to be fed to the top of the board 2.</p>
申请公布号 JP2631931(B2) 申请公布日期 1997.07.16
申请号 JP19920020183 申请日期 1992.02.05
申请人 SEKISUI KASEIHIN KOGYO KK 发明人 YAOSHIRO YASUNOBU;TAKAHASHI MINORU
分类号 B29C65/52;B29C67/20;B29K105/04;B29L7/00;B29L9/00;E04B1/64;E04B1/80;(IPC1-7):B29C67/20 主分类号 B29C65/52
代理机构 代理人
主权项
地址