| 摘要 |
<p>PURPOSE:To increase pins allotted for the input-output of signal in number and to braze power feeding terminals so as to enable the feed of a large current which is stable and small in voltage drop by a method wherein power feeding terminals are fixed to a power feeding pad provided to a multilayer interconnection substrats. CONSTITUTION:Power feeding pins 5 connected to an inner power layer 2 through the intermediary of through-holes 3 and signal input-output pins 4 are provided to the rear of a multilayer interconnection substrate 1, a thin film layer 7 provided with a wiring net 6, which is connected to the pins 4 and 5 through the through-holes 3, inside it is provided to the front side of the multilayer interconnection substrate 1. A power feeding terminals 10 is fitted to a power feeding pad 11 formed on the externally exposed end face of the inner power layer 2. Therefore, input-output pins protruding outward from the rear of the multilayer interconnection substrate 1 can be reduced in number allocated for the power feeding pins 5 but increased in number allocated for the signal input-output pins 4, so that the number of signal input-output electrodes and power feeding electrodes of the multilayer interconnection substrate 1 can be increased respectively. Moreover, a large current can be fed from the brazed terminal 10 to the inner power layer 2 without power loss.</p> |
