| 摘要 |
PURPOSE:To reduce the mounting cost of the title capacitor by putting electrode plates with terminal sections on the upper and lower surfaces of an element multilayer body and enclosing the body with a resin into a chip type shape while the pressure applied in the molding process is maintained, and then, partially exposing the terminal sections from the surface of the enclosing resin. CONSTITUTION:An electrode plate 13 composed of a metallic plate is provided with terminal sections 13a on its two sides facing each other and reinforcing ribs 13b on other two sides facing each other. Then two pieces of the plate 13 are combined with an element multilayer body 6 and the combined body of the plates 13 and body 6 is set inn a bottom mold 14 so that the plate 13 can be put on the upper and lower surfaces of the body 6 and the sections 13a and ribs 13b both facing the outside. After a top mold 16 is put on the bottom mold 13, a heated molten PPS resin is forcedly injected into the mold 14 through a resin injection gate 15 and cured by cooling. Therefore, the mounting density can be increased. |
