发明名称 Process of impregnating substrate and impregnated substrate
摘要 Impregnation of a substrate in the form of a layer having openings comprises keeping one of the substrate surfaces and a resin composition in contact. The resin composition is in liquid form. Also claimed is (1) a substrate which consists of a portion of the resin composition impregnated in it, (2) a prepreg produced by heating to dry and/or cure a substrate having resin impregnated in it, and (3) a laminate comprising at least one substrate and at least one metal layer laminated together.
申请公布号 EP0783946(A2) 申请公布日期 1997.07.16
申请号 EP19970100174 申请日期 1997.01.08
申请人 MATSUSHITA ELECTRIC WORKS, LTD. 发明人 SUGAWA, YOSHIHISA;TOHRIN, YASUO;MARUMOTO, YOSHINOBU;SAKAKIBARA, JOJI;SHINOTANI, KEN-ICHI;KOTERA, KOHEI;OGASAWARA, KENJI;KASHIHARA, KEIKO;IWAMI, TOMOAKI
分类号 B29B15/12;H05K1/03 主分类号 B29B15/12
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