| 摘要 |
PROBLEM TO BE SOLVED: To enable significant reduction in lead time for replacement without detaching a tape carrier package to be replaced in the case where the tape carrier package mounted on a wiring board needs to be replaced. SOLUTION: Two stages of tape carrier packages (TCP) 20 are stacked on the upper side of a wiring board 10. The TCP 20 includes a tape using a base made of an organic resin, such as, polyimide, and has a wiring pattern 21 formed on the front side and a GND layer 22 formed on the back side. An LSI 30 is mounted on the center portion of the TCP 20, and a number of through-holes 23 are formed in the peripheral portion thereof. Plating is performed on the inner peripheral surface of the through-hole 23 and on the front and back side portions adjacent thereto. The front side becomes an outer lead bonding pad 24 and the back side becomes a connection pad 25. The upper and lower TCPs 20 and the wiring board 10 are electrically connected with each other by solder 29. |
