| 摘要 |
PROBLEM TO BE SOLVED: To ensure a semiconductor chip grounding point at a near point by a method wherein a semiconductor package is equipped with a metal base which houses the semiconductor chip and a board connected to the semiconductor chip, and a grounding contact provided to the semiconductor chip is connected direct to the metal base. SOLUTION: A metal base 1 of aluminum is formed through such a manner that an almost square flat aluminum plate is prepared, and the peripheral edge of the flat plate is bent inward. A multilayered resin board 2 possessed of a square opening 2a at its center is provided. An IC chip 3 is bonded to the center of the metal base 1. A step 22a is provided in a part of the opening 2a where a first and a second wiring are exposed. A gap as wide as the step is present between the step 22a and the IC chip 3, the inner surface of the metal base 1 is exposed, and a ground pad for the IC chip 3 is connected to the metal base 1 with a bonding wire. The grounding wire is connected to the outside through the intermediary of the metal base 1, a pin and others, so that a semiconductor chip can be ensured of grounding. |
