| 摘要 |
<p>PROBLEM TO BE SOLVED: To previously prevent the contamination on a wafer and the a chip damage, which are cause by the manual operation of an operator, in the extraction inspection of the wafer after dicing is executed in a dicing device. SOLUTION: In the dicing device 1 for dicing a semiconductor wafer, an inspection wafer storage area storing the suitable wafer for inspecting the dicing state of kerf inspection and the like among wafers after dicing is provided in the dicing device 1. A first cassette 2 storing the wafer before dicing and a second cassette 3 as the inspection wafer storage area for storing the inspection wafer are contained, for example. The second cassette 3 storing the inspection wafer is transported from the dicing device 1 to an inspection process and inspection is executed.</p> |
