发明名称 Interconnect and driver optimization for high performance processors
摘要 A method for determining an optimal design for wiring interconnect and driver power for a designed target delay begins at the floor planning stages of the chip design and may be repeated during the design process. The designer initially specifies a maximum width that wires are allowed to use and a target delay value. Then the designer gives values to weights used in the calculation of an optimization function G(d,p,w), where d is the delay, p is the power, and w is wire width. An "ideal" slope . The designer chooses a slope decrease value from the "ideal" slope value. For each set wire width, the delay (at the proper slope) belonging to that particular wire width is obtained. With these inputs, an optimization program according to the invention is run. This program then calculates values of the function G(d,p,w) for increasing wire pitches, starting with the minimum allowed by the technology. The process continues until (1) the target delay is set by the designer is met, (2) the largest pitch value allowed by the designer is reached, or (3) further calculation will not yield a smaller value for the optimization function.
申请公布号 US5649170(A) 申请公布日期 1997.07.15
申请号 US19950497175 申请日期 1995.06.30
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHAPPELL, BARBARA ALANE;PATEL, PARSOTAM TRIKAM;PHAN, PHOUNG KIM;SAI HALASZ, GEORGE ANTHONY
分类号 G06F17/50;H01L27/02;(IPC1-7):H03H11/26 主分类号 G06F17/50
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