发明名称 PRINTED WIRING BOARD AND PRODUCTION THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To obtain a printed wiring board in which connection with an electronic device can be carried out well even when the wiring circuit pattern is formed with fine pitch by preventing the forming position of land from being shifted. SOLUTION: An outermost wiring circuit pattern 3 is provided, at a specified position thereof, with a resist layer 5 having an opening 4a of specified shape for partially exposing the wiring circuit pattern 3 and the opening 4a is plated, on the inside thereof, with a conductive material to form a land 6a. The wiring circuit pattern 3 is preferably formed by additive method. The resist layer 5 is preferably formed by exposing and developing a photoresist.</p>
申请公布号 JPH09186430(A) 申请公布日期 1997.07.15
申请号 JP19950344157 申请日期 1995.12.28
申请人 SONY CORP 发明人 KUZE YASUO;NAKAMURA EMI;ITO SHIGEYASU
分类号 H05K3/34;H05K3/18;H05K3/24;H05K3/40;H05K3/46;(IPC1-7):H05K3/18 主分类号 H05K3/34
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