| 摘要 |
PROBLEM TO BE SOLVED: To suppress radiation of high frequency noise by a semiconductor device itself. SOLUTION: This device is provided with a frame 1 which is also used as a heat radiating plate, with a part of the frame 1 being electrically connected with external lead terminals 2, with a semiconductor chip 3 being mounted on a surface only of the frame 1, with a gate and a source (or emitter) of the semiconductor chip 3 being junctioned with the external lead terminals 2 by bonding wires 7. with first insulating resin 4, conductive resin 5 and second insulating resin 6 covering the frame 1 and the semiconductor chip 3 in order, and with the external lead terminal 2 and the conductive resin 5 which have an earth potential being connected at A portion to maintain the same electrical potential. |
