| 摘要 |
PURPOSE:To keep product quality at high standard by preventing bonding failure with bonding positions of bonding target pads to leads detected with high precision. CONSTITUTION:For wire bonding with the direction of bonding positions of pads to lead of a bonding target 1 detected by rotating a theta table 2 loaded with the bonding target 1 and by moving an XY table 3 keeping a bonding tool 5 and a detection camera 7, correction values of bonding positions of pads to leads are determined to make pads conform with leads to be bonded. Further, bonding positions of these pads and leads are detected again to add the distance between the bonding tool 5 and the detection camera 7 for bonding. |
