发明名称 Method of assembling electronic component
摘要 A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.
申请公布号 US5647121(A) 申请公布日期 1997.07.15
申请号 US19950487821 申请日期 1995.06.07
申请人 DALLAS SEMICONDUCTOR CORPORATION 发明人 MCLELLAN, NEIL;STRITTMATTER, MIKE;HUNDT, JOSEPH PATRICK;SELLS, CHRISTOPHER M.;SCHERPENBERG, FRANCIS A.
分类号 G04G17/02;G11C5/00;H01R33/74;H05K1/14;H05K3/30;H05K3/34;H05K3/36;H05K7/10;(IPC1-7):H05K3/34 主分类号 G04G17/02
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