| 摘要 |
PROBLEM TO BE SOLVED: To improve the productivity of the exposure step at the time of manufacturing a stereoscopically molded circuit board by providing a light scattering light transmitting part on the mask film of the part opposed to the through hole formed with a plated metal layer. SOLUTION: A plated metal layer 5 is formed in the through hole 3 of a resin stereoscopic molding 2, and an electrodeposited resist film 6 is formed on the layer 5. Then, a mask film 1 is disposed on the film 6, and parallel beams are emitted to expose it. The film 1 used for the exposure has the three types of a non-light scattering light transmitting part 1a, a light shield 1b, and a light scattering light transmitting part 1c, and the part 1c is provided on the part opposed to the hole 3 formed with the layer 5 in the case of the exposure. Then, after the exposure, it is developed, the film 6 is patterned, then etched to remove the layer 5 of the part without the film 6, and then the residual film 6 is removed. |
