| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a uniform heat distribution without using an insulating board. SOLUTION: When lead frames 51 to 519 electrically insulated from each other are provided in the package of a multi-chip module 2 formed of sealing material and a plurality of electronic components including at least two or more heating components 61 , 62 and one or more sub-chips 31 , 32 are mounted thereon, the two or more components 61 , 62 are disposed on lead frames 51 , 52 disposed at both ends in a package 7. Mounting means 111 , 112 for mounting radiating fins are provided at both ends of the package. Even if an insulating board is not provided, the temperature distribution becomes uniform. When the frames 51 , 52 disposed with the components 61 , 62 are widely formed, the distribution becomes further uniform. |
