| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which semiconductor chip components disposed at separate positions can be connected without using an insulating board. SOLUTION: When semiconductor chip components 61 to 64 are provided on a plurality of lead frames 81 to 819 electrically insulated from each other without insulating board and the frames 81 to 819 are contained in a package 7 to constitute a multi-chip module 2, a repeating chip component 3 is provided on a lead frame 510 without insulating board, wire bonding with the component 3 as a second bonding side is conducted, and the components 61 to 64 are connected to the chip 3 via the component 3 and repeating wires 41 to 45 . The second bonding is facilitated, and the chips of the separate positions can be electrically connected. When a semiconductor board is used for the chip component, the bondability of the wires 41 to 45 is further improved. |
