| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to enhance the ultrahigh density of connecting terminals of an LSI chip and a pin grind array or a ball grid array and to easily connect to an external mounting board. SOLUTION: The LSI package having an LSI chip 1 mounted on the insulating board 21 of a pin grid array 20 comprises a plurality of through holes 12 corresponding to pin terminals 23 of the array, a first electrode pad 12a formed at the opening peripheral edge of the side connected with the chips of the holes, a second electrode pad 12b formed at the opening peripheral edge of the side connected with the array of the hole, and a lead pattern 13 for connecting the electrode terminal of the chip to the first electrode pad to mount the chip on the insulation board of the array via a tape carrier 10. |
