| 摘要 |
PROBLEM TO BE SOLVED: To improve the workability and the quality of a multilayered board by mounting the first board, which is obtained by etching the hole position of the metal foil layer at the surface of a core material, on a mirror-surface plate, and obtaining the third board, wherein the conduction of the hole part is secured by plating in the second board obtained by hole-forming process by the projection of laser light. SOLUTION: Copper foils 50 are provided at both surfaces of a core material 51. The copper foils 50 at both surfaces of a part 52 where the hole is to be formed is etched, and the resin surface is exposed. Thus, a first board 55a is obtained. The first board 55a is positioned and mounted at the specified position on a mirror-surface plate 27 of the XY table of the processing mechanism of a processing device. Laser light 29 is projected on holed parts 52, 52,... of the mounted board 55a, and a second board 55b, wherein holes 56, 56,... are formed, is obtained. Placing is performed for the holes 56, 56,... of the second board 55b, and metal films 57, 57,... are formed at the inner-surface side of the holes 56, 56,.... Thus, a third board 55c, wherein the copper-foil layers 50 and 50 at both surfaces are conducted, can be obtained. |
